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MB wafer croping TS 207

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发布时间：2013-12-06 17:13

产地：上海 | 归属行业：切割设备

品牌：梅耶博格Meyer Burger

有效期至：长期有效

MEYER BURGER TECHNOLOGY （梅耶博格） 进入店铺

联系人: 臧小姐

电话: 41-(0)332212800

主营: Bricking, Squaring, Cropping and Wafering. Using our special technologies allows cutting ultra-thin wafers meeting the highest quality requirements of the solar industry

联系地址：上海市南京东路800号新一百大厦20楼A座

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发货期限：自买家付款之日起 3 天内发货
所在地：上海

Best cutting quality WITH minimum kerf loss for PV and semiconductor industrIES

Our inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Robust construction and easy handling are additional features of the TS 207. The machine is loaded manually with silicon ingots or bricks and offers flexibility of use.

The TS 207 is offered in a different layout also for the processing of multicrystalline silicon.

High capacity
Monocrystalline silicon ingots or bricks
Flexible use
High surface and cutting quality
Lowest kerf loss
Lowest Cost of Ownership

Orientable crystal axis

For processing monocristalline silicon the TS 207 is available in two versions (series 8 and 13). The series 8 allows users to orient the crystal axis to the blade prior to cutting. Due to this, wafers can be cut perfectly parallel to the crystal lattice. This complies with highest demands of the semiconductor industry.

TS 207 - Series 8	TS 207 - Series 13
Application	Semi + PV	PV
Material	Mono Si	Mono Si
Cross sections	ø 100 - 215 mm	ø 150 - 215 mm / ø 125 mm / ø 156 mm
Block length	82 - 2100 mm	300 - 2850 mm
Brick length	50 - 760 mm	120 - 1000 mm
Crystal axis orientation	Yes	No
Operation modes	Manual	Semi/Full automatic

关键词：MB wafer croping TS 207 MEYER BURGER TECHNOLOGY （梅耶博格）

上一个：供应PC模内共挤旅行箱板专用生产线下一个： MB--BrickMaster BM 860

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